74HC Semiconductors are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for 74HC Semiconductors. 74HC datasheet, 74HC circuit, 74HC data sheet: PHILIPS – Hex buffer/line driver; 3-state,alldatasheet, datasheet, Datasheet search site for. 74HC datasheet, 74HC pdf, 74HC data sheet, datasheet, data sheet, pdf, Philips, 3-state.
|Published (Last):||22 May 2006|
|PDF File Size:||9.46 Mb|
|ePub File Size:||11.81 Mb|
|Price:||Free* [*Free Regsitration Required]|
74HC/HCT365; Hex buffer/line driver; 3-state
SN74F – Texas Instruments. Both circuits 74hc3665 capable of driving up to 15 low power Schottky inputs. Product device recommended for new designs. The suffix 96 denotes tape and real.
74HC Datasheet, PDF – Qdatasheet
TI is not responsible or liable for such altered documentation. For detailed information please check the most recent version of the relevant product data sheet as datasgeet on these websites.
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Efforts are underway to better integrate information from third parties. Finish options are separated by a vertical ruled line.
Nonetheless, such components are subject to these terms. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Buyers are responsible for their products and applications using TI components.
The similar products page includes products from the same catalog tree srelevant selection guides and products from the same functional category. No rights can be derived from any translation on this website. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that datassheet be provided by TI.
The English language is the official language used at the semiconductors. In the event of any conflict between product information pages and data sheets or deviations from information provided in the product data sheets on these product information pages, the information provided in the product data sheets shall prevail.
Important Information and Disclaimer: Translate this product information page from English to: The ” is identical to the ” but has non-inverting outputs. Products Applications Audio www. When ordering, use the entire part number. Information of third parties may be subject to additional restrictions.
Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Documents Flashcards Grammar checker. All translations on this website are created through the use of Google Dqtasheet Tools and are provided for convenience purposes only.
Philips Semiconductors – PIP – 74HC/HCT; Hex buffer/line driver; 3-state
TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. The package thermal impedance is calculated in accordance with JESD TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. The product status of the product s described in the product data sheet may have changed since publication of the data sheet and therefore information in datasheets on product status may be outdated.
Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. TI has discontinued the production of the device.
Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer’s risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.
Information as of Stay informed. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
These devices are sensitive to electrostatic discharge. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. Samples may or may not be available. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used.
(PDF) 74HC365 Datasheet download
Analog and mixed-signal devices. They have high drive current outputs which enable high speed operation even when driving large bus capacitances. Your browser does not support script. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. TI is not responsible or liable for any such statements.
Device is in production to support existing customers, but TI does not recommend using this part in a new design. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Users should follow proper IC Handling Procedures. Not recommended for new designs.
This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.
Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.