inspektion MIL-STD method , • pull test MIL-STD methode (destructive), methode (non destructive). • shear test ASTM F These test methods cover tests to determine the shear strength of a series of ball bonds made by either thermal compression or thermosonic techniques. ASTM F 1. Scope. These test methods cover tests to determine the shear strength of a series of ball bonds made by either thermal compression or.

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Ball Shear/Solder Ball Shear

The position of shear tool during testing is critical for accurate and repeatable test results. You currently cannot view this content. Please login to your authorized staff account to use this feature.

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F() Test Methods for Destructive Shear Testing of Ball Bonds, –

Register for a trial account. The HS has significant differences to the mode of operation for both…. The bondtester is multipurpose, capable of performing all pull and shear applications. The cavity distributes the load over a larger area and reduces ball deformation.

Link to Active This link will always route to the current Active version of the standard. Board Level Mechanical Drop Tests: Enter your personal account email address to request a password reset: There were no books found for the applied search filters.

They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance. No items in cart. If you like to setup a quick demo, let us know at support madcad.


The Nordson DAGE bondtesters provide wedge shear tests up to 50kg primarily used for the testing of aluminium wedge and ribbon bonds in microwave, high frequency, power, automotive, hybrid and….

They can be used to distinguish between weak and nonadherent ball bonds, of both, and bonds that are acceptably strong. Print 1 2 3 4 5 page sstarting from page current page. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior ff1269 use.

Shear testing is in accordance with:. A very important element of this interconnection is the first bond or ball bond.

Nordson DAGE bondtesters cater for the range of zone shear testing requirements from standard zone shear, low profile zone shear and high force zone shear.

Referenced Documents purchase separately The documents listed below are referenced within the subject standard but are not provided as part of the standard. Nordson DAGE bondtesters provide cavity shear testing as an alternative method for applying a load to a solder ball or ball bond in shear. Touchdown is achieved using a patented load cartridge clamping system and the exceptional position accuracy ensures that every ball bond is sheared at the same height relative to the surface that it is bonded on.

The most common type of interconnection bond is the thermosonic gold or copper wire bond. Are you sure you want to empty the cart?

These test methods can assist in maintaining ff1269 of the process for making ball bonds. Nordson DAGE bondtesters provide: Nordson DAGE bondtesters cater for the range of die shear testing requirements from traditional die shear, high force die shear and low profile die shear.


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Nordson DAGE Bondtesters provide bump shear testing for use in the production test environment to remove the solder ball from a device or substrate. Shear testing is in accordance with: Search book title Enter keywords for book title search. Since the ball aastm method tests only the first bond in a microelectronic wire bond interconnection system, it must be used in a complementary fashion 56 with the wire bond pull test.

ASTM F – 13() Standard Test Methods for Destructive Shear Testing of Ball Bonds

Nordson DAGE bondtesters provide passivation layer shear f1296 up to grams as an alternative to cavity shear and traditional ball shear testing. The values given in parentheses are for information only. The right to access the electronic files of ASTM Standards is for purposes of viewing for individual use only.

The precision alignment of the shear tool to the bond is achieved using optics and joystick control of an XY stage. ASTM grants you a license as follows: Please sign into an account with a subscription to this content, or email for help at support madcad.

Historical Version s – view previous versions of standard. Content only available by subscription. The solder ball sstm test is one of the most common tests undertaken asym a bondtester.